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Sr Staff Package Design Engineer

Physical Design & Layout
182751 Requisition #
Thanks for your interest in the Sr Staff Package Design Engineer position. Unfortunately this position has been closed but you can search our 0 open jobs by clicking here.
Job Requirements:
  • Work with chip/platform teams to manage the package roadmap in terms of Substrate/interposer/module technology to meet production requirements. 
  • Support internal customers regarding package/interposer/module specifications, models and simulations 
  • Use analytical and simulation tools to define package/module design requirements (technology, stackup etc) in the project conception stages and negotiate with chip/system teams on product specification 
  • Work with both internal and external Assembly and manufacturing groups to implement package roadmap; Familiarity with different packaging technologies. 
  • Provide guidance to the team in terms of specifications; work with junior engineers to meet project goals and deadlines 
  • Maintain and upgrade lab for package measurements, characterization, debug. 
  • Work with junior engineers on package measurements. 
  • Come up with performance metrics for silicon and organic interposer technologies in order to design high speed chips and systems 
  • Be on the lookout for new technologies (package/interposer/module technologies, test structures, debug tools etc) that would enhance package design cost/performance benefits. Work with vendors to integrate emerging technology into packages. 
Skills and Experience:
  • College Degree of MS/Ph.D in engineering 
  • Staffing, Technical Leadership, Technical Understanding, Mentor junior package designers in the group 
  • Negotiate with suppliers from far-east and work with the management to align package roadmap and design guidelines. 
  • Experience with large package designs in ceramic and organic technologies 
  • Experience with silicon/organic interposer designs to package multiple chips 
  • About 15 years experience in package/silicon/PCB design and manufacturing for large die, large package, high power and high speed chips 
  • Good knowledge of DoEs, DFM/DFR is required. 
  • Familiarity with 2D/3D package design and modeling tools, such as Solidworks, AutoCAD, Ansys etc. 
  • Excellent analytical, communication and documentation skills 


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

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