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Sr Staff Package Design Engineer

Physical Design & Layout
182751 Requisition #

Marvell is disrupting the server market by delivering high performance ARM processors to the industry. We are looking for motivated individuals to lead the package/interposer/module design effort for multi-chip assembly as we expand the high-end ARM processor product line into higher frequencies and lower process technologies. This position is expected to guide all aspects of design for manufacturability including first/second level reliability, mechanical stress simulations and tradeoffs.  The job requires a high degree of flexibility and responsibilities will change over time. If you enjoy a challenge and an opportunity to grow with us, send in your resume.

Job Requirements:
  • Work with chip/platform teams to manage the package roadmap in terms of Substrate/interposer/module technology to meet production requirements. 
  • Support internal customers regarding package/interposer/module specifications, models and simulations 
  • Use analytical and simulation tools to define package/module design requirements (technology, stackup etc) in the project conception stages and negotiate with chip/system teams on product specification 
  • Work with both internal and external Assembly and manufacturing groups to implement package roadmap; Familiarity with different packaging technologies. 
  • Provide guidance to the team in terms of specifications; work with junior engineers to meet project goals and deadlines 
  • Maintain and upgrade lab for package measurements, characterization, debug. 
  • Work with junior engineers on package measurements. 
  • Come up with performance metrics for silicon and organic interposer technologies in order to design high speed chips and systems 
  • Be on the lookout for new technologies (package/interposer/module technologies, test structures, debug tools etc) that would enhance package design cost/performance benefits. Work with vendors to integrate emerging technology into packages. 
Skills and Experience:
  • College Degree of MS/Ph.D in engineering 
  • Staffing, Technical Leadership, Technical Understanding, Mentor junior package designers in the group 
  • Negotiate with suppliers from far-east and work with the management to align package roadmap and design guidelines. 
  • Experience with large package designs in ceramic and organic technologies 
  • Experience with silicon/organic interposer designs to package multiple chips 
  • About 15 years experience in package/silicon/PCB design and manufacturing for large die, large package, high power and high speed chips 
  • Good knowledge of DoEs, DFM/DFR is required. 
  • Familiarity with 2D/3D package design and modeling tools, such as Solidworks, AutoCAD, Ansys etc. 
  • Excellent analytical, communication and documentation skills 


All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

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