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Sr Staff Package Design Engineer

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Physical Design & Layout
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182751 Requisition #

Marvell is disrupting the server market by delivering high performance ARM processors to the industry. We are looking for motivated individuals to lead the package/interposer/module design effort for multi-chip assembly as we expand the high-end ARM processor product line into higher frequencies and lower process technologies. This position is expected to guide all aspects of design for manufacturability including first/second level reliability, mechanical stress simulations and tradeoffs.  The job requires a high degree of flexibility and responsibilities will change over time. If you enjoy a challenge and an opportunity to grow with us, send in your resume.

 
Job Requirements:
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  • Work with chip/platform teams to manage the package roadmap in terms of Substrate/interposer/module technology to meet production requirements. 
  • Support internal customers regarding package/interposer/module specifications, models and simulations 
  • Use analytical and simulation tools to define package/module design requirements (technology, stackup etc) in the project conception stages and negotiate with chip/system teams on product specification 
  • Work with both internal and external Assembly and manufacturing groups to implement package roadmap; Familiarity with different packaging technologies. 
  • Provide guidance to the team in terms of specifications; work with junior engineers to meet project goals and deadlines 
  • Maintain and upgrade lab for package measurements, characterization, debug. 
  • Work with junior engineers on package measurements. 
  • Come up with performance metrics for silicon and organic interposer technologies in order to design high speed chips and systems 
  • Be on the lookout for new technologies (package/interposer/module technologies, test structures, debug tools etc) that would enhance package design cost/performance benefits. Work with vendors to integrate emerging technology into packages. 
Skills and Experience:
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  • College Degree of MS/Ph.D in engineering 
  • Staffing, Technical Leadership, Technical Understanding, Mentor junior package designers in the group 
  • Negotiate with suppliers from far-east and work with the management to align package roadmap and design guidelines. 
  • Experience with large package designs in ceramic and organic technologies 
  • Experience with silicon/organic interposer designs to package multiple chips 
  • About 15 years experience in package/silicon/PCB design and manufacturing for large die, large package, high power and high speed chips 
  • Good knowledge of DoEs, DFM/DFR is required. 
  • Familiarity with 2D/3D package design and modeling tools, such as Solidworks, AutoCAD, Ansys etc. 
  • Excellent analytical, communication and documentation skills 

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All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.


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