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Test & Product Engineering
190148 Requisition #
Thanks for your interest in the Senior package engineer position. Unfortunately this position has been closed but you can search our 0 open jobs by clicking here.


-        Bachelor’s or master’s degree in Engineering

-        Minimum 8 years FCBGA package development experience.

-        Understand the basic process of FCBGA assembly and flipchip substrate fabrication.

-        Good written and verbal communication skills. Communication experience with Asia OSAT is a plus

-        Familiar with package substrate layout review using Cadence APD. Package substrate design experience using Cadence APD is a plus

-        Basic AutoCAD, MS office and computer skills

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

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